Easic Enhances Etools Software

Easic Corporation has announced the immediate availability of its Etools 8.0 software suite for implementing 45nm Nextreme-2 designs. The Etools 8.0 tool suite delivers a robust ASIC-grade design flow with the simplicity, ease of design and a cost point that is normally associated with FPGA design tools. By focusing on ease of use and low cost of entry, Easic is now enabling designers to make a seamless transition to adopting Nextreme-2 devices as a lower cost and lower power alternative to FPGAs and a lower NRE alternative to traditional ASICs.

The Etools 8.0 software suite includes a number of new capabilities that simplify the transition path for designers looking to adopt the advantages of Nextreme-2 devices. These include a user-friendly GUI-based design environment (Design Navigator); IP wizards that facilitate easier integration of IP blocks; a tool that enables power estimation based on the RTL; and a floor planning tool for making optimal macro placements. Designers have the option of performing synthesis using Magma Talus RTL or Synopsys DC tools.

Unlike traditional standard cell ASIC flows, the Etools 8.0 flow enables designers to focus their efforts on achieving their desired functionality and timing and not on arduous complex deep submicron ASIC tasks such as power mesh design, signal integrity, test insertion, DFM (design for manufacture) and clock insertion. As a result, designers are able to rapidly progress from their initial RTL to a netlist-level handoff to Easic. Nextreme-2’s single-via-based configuration technology enables Easic engineers to tape out and deliver prototypes in six to eight weeks.

Tyco Expands Polyswitch Device Range

Tyco Electronics has announced the addition of an industry-standard 0603 device to its line of surface-mount Polyswitch devices. The FemtoSMDC016F device consumes less than half the board space of prior-generation devices and helps protect sensitive electronics from damage caused by over-current and over-temperature events. The device’s fast time to trip and resettable functionality can help manufacturers reduce warranty costs and improve reliability of portable electronics such as: mobile phones, MP3 players, PDAs, digital cameras, portable computers, Flash drives, USB thumb drives, LCDs and computer peripherals.

 

The Polyswitch FemtoSMDC016F device provides a smaller footprint than other surface-mount devices – measuring 1.6mm x 0.8mm x 0.5mm. This offers flexibility in space-constrained applications. Rated at 9V, the device provides a hold current of 0.16A, a maximum fault current rating of 40A and a maximum resistance of 4.2ohm. The FemtoSMDC device’s low power dissipation and fast time to trip (0.10s at +25C and 1A) make it a logical solution for high-density board designs. The FemtoSMDC016F device is terminated with nickel-tin finish and is compatible with high-volume assembly processes. The EIA-compliant device is halogen free, RoHS compliant and UL and CSA certified. Production quantities are now available in tape and reel packages.

Watlow has brought out the Profibus DP (Decentralized Peripherals) with EZ-Zone PM and EZ-Zone RM integrated temperature controllers. Profibus is a standard for fieldbus communication in automation technology. Watlow’s Profibus DP offering with EZ-Zone PM and EZ-Zone RM integrated controllers simplifies plant design, eliminates hard wiring and requires less hardware, leading to faster commissioning and lower costs.

It supports better diagnostics, speeding up commissioning and helping achieve better productivity and higher product quality through the delivery of better and more timely data to operations and management staff. Watlow’s EZ-Zone Profibus DP features status LED and data rates up to 12Mbps. Features that differentiate Watlow’s offering from other industry products are cyclic read/writes up to 135 data points (244 bytes) as well as acyclic read/write capabilities.

Also included is a generic station description (GSD) file editor for creating customised data-exchange packets, support for both DP-Version 0 and DP-Version 1 functionalities, 16 or 32bit formatting and independent temperature units in Celsius or Fahrenheit.

Kistler has developed a range of low-pressure sensors for foam injection-moulding, where the cavity pressure can be as low as 40 bar, a tenth of the pressure when moulding solid materials. Using Highsens technology, the low-pressure sensors are four times more sensitive than standard pressure sensors, making them ideal for cavity-pressure monitoring when moulding foam materials.

They are available in three diameters, 2.5, four and 6mm, each providing reliable resolution of the pressure profile down to 40 bar. All types are compatible with existing wiring and electronic equipment.

3Dconnexion has announced its range of 3D mice, including the Spacepilot Pro flagship 3D mouse, is now supported by Dassault Systemes’ Catia Version 6 2010 virtual design solution. 3Dconnexion’s 3D mice help engineers working in Catia V6R2010 to more efficiently interact with and collaborate on designs. In addition to the increased control and navigation benefits inherent in 3Dconnexion 3D mice, the Spacepilot Pro 3D mouse also complements the collaborative engineering and improved efficiency focus of Catia V6R2010, with features designed to help engineers save time and reduce interruptions in their design workflows.

Its Quickview Navigation keys offer designers easy access to 32 standard views, allowing Catia users and workgroups to instantly view a design from any angle for improved error detection and design review and verification, while its full-colour LCD Workflow Assistant lists function-key assignments and delivers at-a-glance access to important information. For added productivity, 3Dconnexion’s 3D mice and new Spacepilot Pro are also pre-configured with the most commonly used commands for Catia.

Design engineers also have the flexibility to further customise the programmable buttons to suit their personal workflow needs using Catia’s built-in button-mapping editor. In addition, 3Dconnexion’s 3D mice allow engineers to navigate and control their designs more naturally and intuitively when working with the new direct modelling and visualisation enhancements featured in Dassault Systemes’ V6R2010. With less time spent toggling views and commands within Catia, users are left with more time for the creative elements of a design.

Dassault Systemes has announced that HydroChina Chengdu Engineering has implemented its PLM solutions for investigation, design and collaborative management of hydropower plants. CHIDI has been able to leverage Dassault’s 3D capabilities to provide more lifelike insights into online modelling and designs. The company decided to implement a PLM solution to improve its design quality and overall project management proficiency.

The CATIA solution has ensured precise communication and accurate information exchange across multiple functions and sites. In order to drive greater collaboration with suppliers as well as strategic procurement and project management, CHIDI has also deployed Dassault’s ENOVIA collaborative business process platform. In addition, CHIDI is using 3DVIA Composer to produce 3D documentation for publications, ensuring effective communication with proprietors and construction units.

CMOS Switch Operates With Hi-Speed USB

Toshiba Electronics Europe (TEE) has introduced a miniature, low-power CMOS switch IC for use in USB 2.0 (Hi-Speed USB) applications. The TC7USB221 is a USB 2.0 dual single pole double throw (SPDT) bus switch with low ON resistance and low pin capacitance, making it suitable for Hi-Speed USB operation with data rates up to 480Mbps. A typical application for the IC would be a multiplexer/demultiplexer function between two USB controllers. The switch operates within a voltage range of 2.3V and 3.6V, has a typical ON resistance of 6.5ohm and a low typical switch on capacitance of 7pF.

This results in a typical 3dB bandwidth of 720MHz and 820MHz for the TSSOP and WLCSP package, respectively. A maximum quiescent current of 2uA (at 3.6V) helps designers to reduce system power consumption. Switching between different ports is achieved via a select pin, while an output enable (OE) pin can be used to isolate a USB controller and devices. Designed to minimise board space, the TC7USB221 is available in two package options.

The miniature WCSP10 package measures 1.6mm x 1.2mm x 0.67mm, while the TSSOP14 alternative has dimensions of 4.4mm x 5.4mm x 1.2mm. OE and I/O pins are equipped with power-down protection. In addition, every pin is equipped with ESD protection according to machine model and human body model of at least 200V and 2,000V, respectively.

Card Edge Connectors Support PCIe Standards

Sullins Connector Solutions is offering a series of PCI Express (PCIe) card edge connectors designed to enable easy and cost-effective implementation of PCIe architecture. These connectors support the PCIe standards for signal and power as well as auxiliary signals at the interface between the motherboard and add-in card. The 1mm pitch, one-piece parts feature slots accepting 1.58mm (0.062in) thick add-on graphics cards for user upgrades and support x1, x4, x8, x16, x24 and x32 contact positions to accommodate an extensive range of bandwidth requirements.

The series is engineered to optimise both design flexibility and manufacturing efficiencies as devices are provided in a wide range of termination types and mounting styles. Part serial lanes are comprised of two differential wire pairs that support a data transfer rate of 500MB/s in each direction, per lane. They feature a 2.5GHz clock rate and a 5GT/s (gigatransfers per second) bit rate. The devices are suitable for dense packaging, board-to-board applications requiring the connection of a mother board to a 1.58mm (0.062in +/- 0.008in) daughtercard.

Sullins PCIe card edge connectors are often specified for use in desktop computers, servers, workstations, storage systems, redundant array of independent disks (Raid) controllers, fibre channel host-bus adapters, routers and switches. Parts are offered with 36(x1), 64(x4), 98(x8) and 164(x16) contact positions in right angle, surface mount and card extender versions. Dip solder straight styles are available in 36(x1), 64(x4), 98(x8), 164(x16), 230(x24) and 280(x32) contact positions. The 230(x24) and 280(x32) versions are used to support riser card applications. Most connectors are provided with a choice of tail length options, including 2.3mm, 2.54mm or 3mm, to accommodate differing motherboard thicknesses.

For added mechanical support and accurate PCB alignment, devices may be ordered with ear clips, pegs, clamps or handles. The PCIe series features a current rating of 1.1A per contact. Additional specifications include an operating temperature range of -55C to +105C and a processing temperature of up to 260C peak for 10 seconds max. Parts are provided with phosphor bronze contacts, and offered standard with gold flash, 10uin, or 30uin selective gold plating over 50 micro inch nickel underplate. Housing material is UL94V-0 rated.

XPhase Chipset Powers DDR3 Memory Modules

International Rectifier has introduced the IR3522 and IR3506 XPhase chipset to provide a complete power solution for DDR3 multi-phase memory applications. The IR3522 dual-output PWM controller with built-in I2C interface provides overall system control for both the DDR3 VDDQ and VTT rails. The device interfaces with any number of IR3506 phase ICs to drive as many phases as needed to power any number of DDR3 dual in-line memory modules (DIMMS), simplifying layout and reducing board space.

The IR3522/IR3506 chipset enables accurate tracking with the additional flexibility of margining between the VDDQ and VTT outputs through the I2C interface. The Xphase solution for DDR3 applications delivers a power supply that is smaller, more flexible and easier to design while providing higher efficiency from light load to full load when compared to conventional approaches, according to International Rectifier. The IR3522 combines the precision of analogue control with programmability of power management functions via I2C.

It allows output voltage programming capability for both VDDQ and VTT outputs through the I2C compatible interface with a VDDQ set point error of +/-0.5 per cent. The IR3506 provides both source and sink capability to enable more accurate tracking of the VTT output to VDDQ. It supports a power-saving function (PSI) to maximise efficiency at light loads. The IR3522’s I2C interface programs the VTT tracking ratio +/- 25 per cent and provides digital on/off control. Four I2C addresses are selectable using two ADDR pins, while four different VREF1 voltages are selectable using two VID pins if I2C communication is not available.

Soft-stop turn-off to ensure VDDR and VTT tracking is also featured, as well as a fault activated Crowbar pin to drive external NMOS devices for external output voltage protection. As with all Xphase ICs, the IR3522 features protection against over-current, over-voltage, open remote sense and open control. The IR3506 phase IC features 7V/2A gate drivers (4A GATEL sink current) and supports loss-less inductor current sensing. The device also features a soft-stop turn-off to ensure VDDR and VTT tracking.

The IR3506 offers over-current protection during PSI assertion mode operation, integrated bootstrap synchronous PFET, debugging function, self-calibration of PWM ramp, current sense amplifier and current share amplifier and single-wire bidirectional average current sharing.

American Industrial Systems (AIS) has introduced a low-cost touch-screen panel PC line featuring Intel Celeron and Core 2 processors in a rugged enclosure to withstand tough industrial environments. Integrated touch screens, aluminum IP65-rated front bezels and industrial grade LCD panels are standard equipment throughout the line. The panel PCs are currently available in 7in, 12in, 15in and 17in sizes; the 7in and 12in feature the fanless Intel ultra-low-voltage Celeron M processor.

The 15in and 17in panel PCs run on the Intel Core 2 Duo platform with Intel Q965 Chipset, which meets the requirements of the most interactive and system demanding clients. The units are encased in an aluminum and steel housing, protecting the components from harsh industrial environments including shock/vibration, dust, water and temperature shocks. Standard VESA spaced holes and flush panel mounting options are available for integration into existing or new systems.